14th International Conference on Shot Peening
14th International Conference on Shot Peening
Kiyotaka MASAKIa, Yuji SANOb,c,d, Yoshio MIZUTAc, Satoshi TAMAKId,
Okinawa College, National Institute of Technology, Nago 905-2192, JAPAN
masaki-k@okinawa-ct.ac.jp
Institute for Molecular Science, Okazaki 444-8585, JAPAN
Osaka University, SANKEN, Ibaraki 567-0047, JAPAN
LAcubed Co. Ltd., Yokohama 220-0012, JAPAN
Introduction
Laser peening (LP) processing is one of peening technologies in which a metal material placed in water is irradiated with a pulse laser and peened by the generated shock wave. Since conventional laser peening requires large-scale and high-cost laser equipment, smaller and cheaper pulse laser oscillators have been desired for further industrial applications. In recent years, new handheld pulse lasers have been developed by ImPACT Program in Japan that are much smaller and cheaper than currently-used equipment.
Objectives
In order to investigate the effectiveness of the new-developed handheld laser device for LP treatment, rotating bending fatigue tests were conducted on Al-Zn-Mg-Cu system aluminum alloys.
18 Novembre 2022